Non-Destructive Real-Time Imaging of Warpage and Failure Modes in Integrated Circuit Packages
Development of novel x-ray diffraction-based techniques for the nondestructive mapping of warpage, strain and bow in semiconductor die inside fully encapsulated advanced chip packages.
Internal Collaborators
Prof. Paddy McNally, Dr Nima Gorgi (Funded Postdoctoral Researcher)
External Collaborators
Prof Brian Tanner, Durham University, UK. Dr Andreas Danilewsky, Freiburg University, Germany.
Funding Body
Irish Research Council