Non-Destructive Real-Time Imaging of Warpage and Failure Modes in Integrated Circuit Packages

Project Description

Development of novel x-ray diffraction-based techniques for the nondestructive mapping of warpage, strain and bow in semiconductor die inside fully encapsulated advanced chip packages.

Internal Collaborators

Prof. Paddy McNally, Dr Nima Gorgi (Funded Postdoctoral Researcher)

External Collaborators

Prof Brian Tanner, Durham University, UK. Dr Andreas Danilewsky, Freiburg University, Germany.

Funding Body

Irish Research Council